MAX5976A/MAX5976B 19-5542 Rev 1 4/11 2.7V to 18V, 7A, Hot-Swap Solution General Description Features The MAX5976A/MAX5976B are integrated solutions for S 2.7V to 18V Operating Voltage Range hot-swap applications requiring the safe insertion and S 24mI Internal Power MOSFET removal of circuit line cards from a live backplane. The S 7A Load Current Capability devices integrate a hot-swap controller, 24mI power S No Sense Resistor Required MOSFET, and electronic circuit-breaker protection in a single package. The ICs are designed for protection of S 10% Circuit-Breaker Threshold Accuracy 2.7V to 18V supply voltages. S Adjustable Circuit-Breaker Current The devices provide inrush current control and short- S Variable Speed Circuit-Breaker Response circuit detection during startup. During normal operation, S Thermal Protection the devices provide circuit-breaker protection against overload and short-circuit conditions. The circuit-breaker S Power-Good and Fault Outputs function disconnects the power to the load if the load S Latch-Off or Automatic Retry Options current exceeds the circuit-breaker limit. The devices S Drive-Present Signal Input are factory-calibrated to deliver accurate overcurrent protection with Q10% accuracy. During a fault condi- S Active-Low and Active-High Enables tion, the MAX5976A enters an autoretry mode while the MAX5976B latches off. Both versions feature a resistor- adjustable variable speed circuit-breaker threshold and overtemperature protection. Additional features include Ordering Information power-good and fault indicator outputs. FAULT The ICs are available in a 16-pin, 5mm x 5mm, TQFN- PART PIN PACKAGE MANAGEMENT EP package and fully specified over the -40 C to +85 C operating temperature range. MAX5976AETE+ 16 TQFN-EP* Autoretry MAX5976BETE+ 16 TQFN-EP* Latched Off Applications Note: All devices are specified over the -40C to +85C operating temperature range. RAID Systems +Denotes a lead(Pb)-free/RoHS-compliant package. Storage Bridge Bay *EP = Exposed pad. Disk Drive Power Server I/O Cards Industrial Typical Application Circuit 2.7V TO 18V REMOVABLE CARD IN OUT LOAD (7A) V IN C IN T VS V PRESDET R1 PRESDET ON1 MAX5976A R2 MAX5976B R CB R ON2 CB ON2 RPG REG PG C REG R FAULT FAULT 2.7V TO 6V GND P Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maxim-ic.com. EVALUATION KIT AVAILABLE2.7V to 18V, 7A, Hot-Swap Solution ABSOLUTE MAXIMUM RATINGS IN to GND ..............................................................-0.3V to +20V Operating Ambient Temperature Range ........... -40NC to +85NC CB to GND ..............................................-0.3V to (V + 0.3V) Maximum Junction Temperature .....................................+150NC REG ON1, REG to GND ..................................................-0.3V to +6V Storage Temperature Range ............................ -60NC to +150NC OUT, ON2, PRESDET Lead Temperature (soldering, 10s) ................................+300NC to GND ...............-0.3V to the lower of (V + 0.3V) and +20V Soldering Temperature (reflow) ......................................+260NC IN PG, FAULT to GND ...............................................-0.3V to +26V Continuous Power Dissipation (T = +70NC) A TQFN (derate 33.3mW/NC above +70NC) (Note 1) ..2666.7mW Note 1: As per JEDEC51 standard (multilayer board). Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 2) TQFN Junction-to-Case Thermal Resistance (B ) ...................30NC/W JC Junction-to-Ambient Thermal Resistance (B ) ..................2NC/W JA Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = 12V, V = 2V, V = V = 0V, R = 40kI, T = T = -40NC to +85NC, unless otherwise noted. Typical values are IN ON1 ON2 PRESDET CB A J at T = +25NC.) (Note 3) A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Supply Voltage Range V 2.7 18 V IN V = 3V, no load, 7A current-limit ON1 Input Supply Current I 5 7.5 mA IN threshold Default Undervoltage Lockout V V rising, V = V 2.35 2.5 2.65 V UVLO IN ON1 IN Default Undervoltage Lockout V 0.1 V UVLO HYS Hysteresis ON1 Turn-On Threshold V V rising 1.17 1.21 1.25 V ON1 TH ON1 ON1 Turn-On Threshold V V falling 0.1 V ON1 HYS ON1 Hysteresis ON1 Input Bias Current I V = 0 to 5V -1 +1 FA ON1 ON1 CURRENT LIMIT R = 40kI 6.3 7 7.7 CB R = 28.57kI 4.5 5 5.5 Circuit-Breaker Accuracy CB I A CB,TH (At Startup) R = 20kI 3.15 3.5 3.85 CB R = 10kI 1.575 1.75 1.925 CB 0.6% overcurrent 2.7 ms Slow-Comparator Response t SCD Time (Note 4) 30% overcurrent 200 Fs MOSFET Total On-Resistance R 15 24 41 mI ON LOGIC INPUTS (ON2, PRESDET) Low Voltage Input V 2.7V < V < 18V 0.4 V IL IN High Voltage Input V 2.7V < V < 18V 1.4 V IH IN Input Current I V , V = 0 to 6V -1 +1 FA IN ON2 PRESDET 2 MAX5976A/MAX5976B