Product Information

MAX16963SATEF/V+T

MAX16963SATEF/V+T electronic component of Analog Devices

Datasheet
Switching Voltage Regulators Dual 2.2MHz, Low-Voltage Step-Down DC-DC Converter

Manufacturer: Analog Devices
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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2500: USD 5.6937 ea
Line Total: USD 14234.25

0 - Global Stock
MOQ: 2500  Multiples: 2500
Pack Size: 2500
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Ships to you between Thu. 04 Apr to Wed. 10 Apr

MOQ : 2500
Multiples : 2500

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MAX16963SATEF/V+T
Analog Devices

2500 : USD 5.6937
5000 : USD 5.3887
10000 : USD 5.3114
15000 : USD 5.2342
20000 : USD 5.1569
25000 : USD 5.0796
250000 : USD 5.0024

     
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EVALUATION KIT AVAILABLE MAX16963 Dual 2.2MHz, Low-Voltage Step-Down DC-DC Converter General Description Benefits and Features The MAX16963 is a high-efficiency, dual synchronous S Small Size Components step-down converter that operates with a 2.7V to 5.5V Dual 2.2MHz DC-DC Converter input voltage range and provides a 0.8V to 3.6V output S Ideal for Point-of-Load Applications voltage range. The device delivers up to 1.5A of load Up to 1.5A Output Current current per output. The low input/output voltage range Adjustable Output Voltage: 0.8V to 3.6V and the ability to provide high output currents make this 2.7V to 5.5V Operating Supply voltage device ideal for on-board point-of-load and postregulation S High Efficiency at Light Load applications. The device achieves Q3% output error over Skip Mode with 36A Quiescent Current load, line, and temperature ranges. S Low Electromagnetic Emission The device features a 2.2MHz fixed-frequency PWM mode Programmable SYNC I/O Pin for better noise immunity and load transient response, Spread Spectrum and a skip mode for increased efficiency during light-load operation. The 2.2MHz frequency operation allows for S Low Power Mode Saves Energy Independent Enable Inputs an all-ceramic capacitor design and small-size external components. An optional spread-spectrum frequency S Output Rail Monitoring Helps Prevent System Failure modulation minimizes radiated electromagnetic emissions Open-Drain Power-Good Output due to the switching frequency. S Limits Inrush Current During Startup On-board low R switches help minimize efficiency DSON Built-In Soft-Start Timer losses at heavy loads and reduce critical/parasitic induc- S Overtemperature and Short-Circuit Protections tance, making the layout a much simpler task with respect S 4mm x 4mm, 16-Pin TQFN and 16-Pin TSSOP to discrete solutions. Following a simple layout and footprint Packages ensures first-pass success in new designs. S -40NC to 125NC Operating Temperature Range The device is offered in a factory-preset output voltage or adjustable output-voltage version (see the Selector Guide Ordering Information appears at end of data sheet. for options). Factory-preset output-voltage versions allow customers to achieve Q3% output-voltage accuracy without using external resistors, while the adjustable output-voltage Typical Application Circuit version provides the flexibility to set the output voltage to any desired value between 0.8V and 3.6V using an external V PV1 resistive divider. PV1 OUTS1 Additional features include 8ms fixed soft-start, 16ms 2.2H 4.7F EN1 fixed power-good delay, overcurrent, and overtemperature LX1 V OUT1 V PV2 protections. 22F PV2 PGND1 The MAX16963 is available in thermally enhanced 16-pin 4.7F EN2 TSSOP-EP and 4mm x 4mm, 16-pin TQFN-EP packages, OUTS2 and is specified for operation over the -40NC to +125NC 1.5H V PV V LX2 OUT2 automotive temperature range. 10 PV 22F PGND2 1F Applications GND V V OUT1 OUT2 Automotive Postregulation Industrial/Military 20k MAX16963 20k Point-of-Load Applications PG2 PG1 EP For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxims website at www.maximintegrated.com. 19-6487 Rev 5 7/15MAX16963 Dual 2.2MHz, Low-Voltage Step-Down DC-DC Converter ABSOLUTE MAXIMUM RATINGS PV, PV1, PV2 to GND ..............................................-0.3V to +6V Continuous Power Dissipation (T = +70NC) A EN1, EN2, PG1, PG2 to GND .................................-0.3V to +6V TQFN (derate 25mW/NC above +70NC)................... 2000mW* LX Current ........................................................... 1.6 (Note 1) TSSOP (derate 26.1mW/NC above +70NC)........... 2088.8mW* PGND1 and PGND2 to GND ..............................-0.3V to +0.3V Operating Temperature Range ........................ -40NC to +125NC PV to PV1 and PV2 ...............................................-0.3V to +0.3V Junction Temperature .....................................................+150NC LX1 and LX2 Continuous RMS Current ...................................1A Storage Temperature Range ............................ -65NC to +150NC All Other Pins Voltages to GND .. (V + 0.3V) to (V - 0.3V) Lead Temperature (soldering, 10s) ................................+300NC PV GND Output Short-Circuit Duration ....................................Continuous Soldering Temperature (reflow) ......................................+260NC *As per JEDEC51 Standard (multilayer board). Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional opera- tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: LX has internal clamp diodes for PGND and PV . Applications that forward bias these diodes should take care not to exceed the ICs package power-dissipation limits. PACKAGE THERMAL CHARACTERISTICS (Note 2) TQFN TSSOP Junction-to-Ambient Thermal Resistance (B ) ..........40NC/W Junction-to-Ambient Thermal Resistance (B ) .......38.3NC/W JA JA Junction-to-Case Thermal Resistance (B ) .................6NC/W Junction-to-Case Thermal Resistance (B ) .................3NC/W JC JC Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (V = V = V = 5V, V = 5V, T = T = -40C to +125C, unless otherwise noted. Typical values are at T = +25C.) (Note 3) PV PV1 PV2 EN A J A PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage Range V Normal operation 2.7 5.5 V PV Supply Current I No load, V = 0V 16 36 60 FA PV PWM Shutdown Supply Current I V = V = 0V, T = +25 C 1 5 FA SHDN EN1 EN2 A Undervoltage Lockout Threshold V 2.37 V UVLO L Low Undervoltage Lockout Threshold V 2.6 V UVLO H High Undervoltage Lockout Hysteresis 0.07 V SYNCHRONOUS STEP-DOWN DC-DC CONVERTER 1 FB Regulation Voltage V 800 mV OUTS1 I = 4% to 100% -3 0 +3 % LOAD Feedback Set-Point Accuracy V OUTS1 I = 0% -0.5 +2 +3 % LOAD pMOS On-Resistance R V = 5V, I = 0.4A 90 148 mI DSON P1 PV1 LX1 nMOS On-Resistance R V = 5V, I = 0.8A 68 128 mI DSON N1 PV1 LX1 Maximum pMOS Current-Limit I 1.95 2.35 3.15 A LIMP1 Threshold Maxim Integrated 2

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

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