Product Information

ICE5LP1K-SWG36ITR50

ICE5LP1K-SWG36ITR50 electronic component of Lattice

Datasheet
Lattice FPGA - Field Programmable Gate Array ICE5LP,1100LUTs,1.2V FPGA

Manufacturer: Lattice
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - Global Stock

MOQ : 1
Multiples : 1
1 : USD 7.5859
25 : USD 2.6926
100 : USD 2.589
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Series
Number of Logic Elements
Number of I/Os
Operating Supply Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Package / Case
Packaging
Brand
Distributed Ram
Embedded Block Ram - Ebr
Maximum Operating Frequency
Total Memory
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
Taric
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
ICE40HX8K-B-EVN electronic component of Lattice ICE40HX8K-B-EVN

Programmable Logic IC Development Tools iCE40HX8K Breakout Board
Stock : 3

ICE5LP2K-SWG36ITR50 electronic component of Lattice ICE5LP2K-SWG36ITR50

iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 2048 36-XFBGA, WLCSP
Stock : 0

ICE40LM4K-S-EVN electronic component of Lattice ICE40LM4K-S-EVN

Programmable Logic IC Development Tools ICE40LM4K Sensor Evaluation Kit
Stock : 1

ICE40LP8K-USBC-EVN electronic component of Lattice ICE40LP8K-USBC-EVN

Programmable Logic IC Development Tools iCE40LP8K USB Type-C Demo Kit V2
Stock : 0

ispPAC-POWR6AT6-01SN32I electronic component of Lattice ispPAC-POWR6AT6-01SN32I

Power Supply Controller Power Supply Controller/Monitor 32-QFNS (5x5)
Stock : 0

ISPLSI 2192VE-100LB144ADN electronic component of Lattice ISPLSI 2192VE-100LB144ADN

CPLD ispLSI 2000VE Family 8K Gates 192 Macro Cells 100MHz 3.3V
Stock : 0

ISPLSI 5256VE-100LF256 electronic component of Lattice ISPLSI 5256VE-100LF256

IPL5256VE / USE ISPMACH 4000V
Stock : 0

ISPLSI 2032A-80LJ44 electronic component of Lattice ISPLSI 2032A-80LJ44

32 MC, 32 I/O, ISP, 5V / USE I
Stock : 1

LC4032ZC-75T48E electronic component of Lattice LC4032ZC-75T48E

CPLD - Complex Programmable Logic Devices PROGRAMMABLE SUPER FAST HI DENSITY PLD
Stock : 0

HDMI-VIP-IB-EVN electronic component of Lattice HDMI-VIP-IB-EVN

Interface Development Tools HDMI VIP Input Bridge Board
Stock : 13

Image Description
ICE5LP2K-SWG36ITR50 electronic component of Lattice ICE5LP2K-SWG36ITR50

iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 26 81920 2048 36-XFBGA, WLCSP
Stock : 0

LCMXO2280C-3FTN324C electronic component of Lattice LCMXO2280C-3FTN324C

MachXO Field Programmable Gate Array (FPGA) IC 271 28262 2280 324-LBGA
Stock : 84

LCMXO2-4000ZE-1TG144I electronic component of Lattice LCMXO2-4000ZE-1TG144I

FPGA - Field Programmable Gate Array 4320 LUTs 115 IO 1.2V 1 Spd
Stock : 1

PL22V1015N electronic component of Philips PL22V1015N

PL22V1015N E2 UNIV PAL 15NS TPD DIP
Stock : 0

LCMXO1200C-3TN100I electronic component of Lattice LCMXO1200C-3TN100I

FPGA - Field Programmable Gate Array 1200 LUTs 73 I/O 1.8/2.5/3.3V IND
Stock : 1564

A3P060-FGG144 electronic component of Microchip A3P060-FGG144

FPGA - Field Programmable Gate Array A3P060-FGG144 LEAD FREE
Stock : 159

EP1K30FC256-3 electronic component of Intel EP1K30FC256-3

FPGA - Field Programmable Gate Array FPGA - ACEX 1K 216 LABs 171 IOs
Stock : 1

LCMXO3L-9400C-5BG484C electronic component of Lattice LCMXO3L-9400C-5BG484C

FPGA - Field Programmable Gate Array MachXO3L; 9400 LUTs; 3.3V
Stock : 1

A3P060-VQG100I electronic component of Microchip A3P060-VQG100I

FPGA - Field Programmable Gate Array A3P060-VQG100I LEAD FREE
Stock : 201

A54SX32A-BG329I electronic component of Microchip A54SX32A-BG329I

FPGA - Field Programmable Gate Array A54SX32A-BG329I
Stock : 1

iCE40 Ultra Family Data Sheet FPGA-DS-02028-2.3 August 2018 iCE40 Ultra Family Data Sheet Contents Acronyms in This Document ................................................................................................................................................. 5 1. General Description ...................................................................................................................................................... 6 1.1. Features ............................................................................................................................................................... 6 2. Product Family .............................................................................................................................................................. 7 2.1. Overview ............................................................................................................................................................. 7 3. Architecture .................................................................................................................................................................. 8 3.1. Architecture Overview ........................................................................................................................................ 8 3.1.1. PLB Blocks ....................................................................................................................................................... 9 3.1.2. Routing .......................................................................................................................................................... 10 3.1.3. Clock/Control Distribution Network ............................................................................................................. 10 3.1.4. sysCLOCK Phase Locked Loops (PLLs)............................................................................................................ 10 3.1.5. sysMEM Embedded Block RAM Memory ..................................................................................................... 12 3.1.6. sysDSP ........................................................................................................................................................... 14 3.1.7. sysIO Buffer Banks ........................................................................................................................................ 18 3.1.8. sysIO Buffer ................................................................................................................................................... 21 3.1.9. On-Chip Oscillator ......................................................................................................................................... 22 2 3.1.10. User I C IP ................................................................................................................................................. 22 3.1.11. User SPI IP ................................................................................................................................................. 22 3.1.12. High Current LED Drive I/O Pins ............................................................................................................... 22 3.1.13. Embedded PWM IP ................................................................................................................................... 23 3.1.14. Non-Volatile Configuration Memory ........................................................................................................ 23 3.2. iCE40 Ultra Programming and Configuration .................................................................................................... 24 3.2.1. Device Programming ..................................................................................................................................... 24 3.2.2. Device Configuration..................................................................................................................................... 24 3.2.3. Power Saving Options ................................................................................................................................... 24 4. DC and Switching Characteristics ................................................................................................................................ 25 4.1. Absolute Maximum Ratings .............................................................................................................................. 25 4.2. Recommended Operating Conditions ............................................................................................................... 25 4.3. Power Supply Ramp Rates ................................................................................................................................. 26 4.4. Power-On Reset ................................................................................................................................................ 26 4.5. Power-up Supply Sequence ............................................................................................................................... 26 4.6. External Reset ................................................................................................................................................... 26 4.7. Power-On-Reset Voltage Levels ........................................................................................................................ 27 4.8. ESD Performance ............................................................................................................................................... 28 4.9. DC Electrical Characteristics .............................................................................................................................. 28 4.10. Supply Current ................................................................................................................................................... 29 2 4.11. User I C Specifications ....................................................................................................................................... 29 4.12. User SPI Specifications ...................................................................................................................................... 30 4.13. Internal Oscillators (HFOSC, LFOSC) .................................................................................................................. 30 4.14. sysI/O Recommended Operating Conditions .................................................................................................... 30 4.15. sysI/O Single-Ended DC Electrical Characteristics ............................................................................................. 31 4.16. Differential Comparator Electrical Characteristics ............................................................................................ 31 4.17. Typical Building Block Function Performance ................................................................................................... 31 4.17.1. Pin-to-Pin Performance (LVCMOS25) ....................................................................................................... 31 4.17.2. Register-to-Register Performance ............................................................................................................ 32 4.18. Derating Logic Timing ........................................................................................................................................ 32 4.19. Maximum sysIO Buffer Performance ................................................................................................................ 32 4.20. iCE40 Ultra Family Timing Adders ..................................................................................................................... 33 4.21. iCE40 Ultra External Switching Characteristics.................................................................................................. 33 4.22. sysCLOCK PLL Timing ......................................................................................................................................... 34 4.23. sysDSP Timing .................................................................................................................................................... 35 4.24. SPI Master or NVCM Configuration Time .......................................................................................................... 35 2015-2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 2 FPGA-DS-02028-2.3

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LA4
LAT
LATTICE SEMI
Lattice Semiconductor
Lattice Semiconductor Corporation
Vantis

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted