Product Information

CYBL10461-56LQXI

CYBL10461-56LQXI electronic component of Infineon

Datasheet
RF Microcontrollers - MCU PRoC BLE CYBL1046x 32b 48MHz ARM Cortex

Manufacturer: Infineon
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Price (USD)

1: USD 3.5096 ea
Line Total: USD 3.5096

66 - Global Stock
Ships to you between
Thu. 04 Apr to Wed. 10 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
66 - Global Stock


Ships to you between Thu. 04 Apr to Wed. 10 Apr

MOQ : 1
Multiples : 1
1 : USD 3.5096

66 - Global Stock


Ships to you between Thu. 04 Apr to Wed. 10 Apr

MOQ : 2
Multiples : 1
2 : USD 3.5812

     
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CYBL10X6X Family Datasheet Programmable Radio-on-Chip With Bluetooth Low Energy (PRoC BLE) General Description PRoC BLE is a 32-bit, 48-MHz ARM Cortex -M0 BLE solution with CapSense , 12-bit ADC, four timer, counter, pulse-width 2 modulators (TCPWM), thirty-six GPIOs, two serial communication blocks (SCBs), LCD, and I S. PRoC BLE includes a royalty-free BLE stack compatible with Bluetooth 4.1 and provides a complete, programmable, and flexible solution for HID, remote controls, toys, beacons, and wireless chargers. In addition to these applications, PRoC BLE provides a simple, low-cost way to add BLE connectivity to any system. Features Four dedicated 16-bit TCPWMs Bluetooth Smart Connectivity Additional four 8-bit or two 16-bit PWMs Bluetooth 4.1 single-mode device Programmable LVD from 1.8 V to 4.5 V 2.4-GHz BLE radio and baseband with integrated balun 2 I S Master interface TX output power: 18 dBm to +3 dBm Received signal strength indicator (RSSI) with 1-dB resolution Clock, Reset, and Supply RX sensitivity: 89 dBm Wide supply-voltage range: 1.9 V to 5.5 V TX current: 15.6 mA at 0 dBm 3-MHz to 48-MHz internal main oscillator (IMO) with 2% accuracy RX current: 16.4 mA 24-MHz external clock oscillator (ECO) without load capaci- ARM Cortex-M0 CPU Core tance 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit 32-kHz WCO multiply, operating at up to 48 MHz Programmable GPIOs 128-KB flash memory 36 GPIOs configurable as open drain high/low, 16-KB SRAM memory pull-up/pull-down, HI-Z, or strong output Emulated EEPROM using flash memory Any GPIO pin can be CapSense, LCD, or analog, with flexible Watchdog timer with dedicated internal low-speed oscillator pin routing (ILO) Programming and Debug Ultra-Low-Power 2-pin SWD 1.3-A Deep-Sleep mode with watch crystal oscillator (WCO) In-system flash programming support on 150-nA Hibernate mode current with SRAM retention Temperature and Packaging 60-nA Stop mode current with GPIO wakeup Operating temperature range: 40 C to +105 C Available in 56-pin QFN (7 mm 7 mm) and 68-ball WLCSP CapSense Touch Sensing with Two-Finger Gestures (3.52 mm 3.91 mm) packages Up to 36 capacitive sensors for buttons, sliders, and touchpads PSoC Creator Design Environment Two-finger gestures: scroll, inertial scroll, pinch, stretch, and edge-swipe Easy-to-use IDE to configure, develop, program, and test a BLE application Cypress Capacitive Sigma-Delta (CSD) provides best-in-class SNR (> 5:1) and liquid tolerance Option to export the design to Keil, IAR, or Eclipse Automatic hardware-tuning algorithm (SmartSense) Bluetooth Low Energy Protocol Stack Peripherals Bluetooth Low Energy protocol stack supporting generic access profile (GAP) Central, Peripheral, Observer, or Broad- 12-bit, 1-Msps SAR ADC with internal reference, caster roles sample-and-hold (S/H), and channel sequencer Switches between Central and Peripheral roles on-the-go Ultra-low-power LCD segment drive for 128 segments with Standard Bluetooth Low Energy profiles and services for operation in Deep-Sleep mode interoperability 2 Two serial communication blocks (SCBs) supporting I C Custom profile and service for specific use cases (Master/Slave), SPI (Master/Slave), or UART Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Document Number: 001-90478 Rev. *K Revised August 19, 2015 This datasheet has been downloaded from PRoC BLE: CYBL10X6X Family Datasheet Contents Blocks and Functionality ................................................. 3 Digital Peripherals ..................................................... 26 CPU Subsystem .......................................................... 4 Memory ..................................................................... 29 BLE Subsystem........................................................... 4 System Resources .................................................... 29 System Resources Subsystem ................................... 4 Ordering Information...................................................... 33 Peripheral Blocks ........................................................ 6 Part Numbering Conventions .................................... 34 Pinouts .............................................................................. 8 Packaging........................................................................ 35 Power............................................................................... 13 Acronyms........................................................................ 38 Low-Power Modes..................................................... 13 Document Conventions ................................................. 40 Development Support .................................................... 15 Units of Measure ....................................................... 40 Documentation .......................................................... 15 Revision History ............................................................. 41 Online ........................................................................ 15 Sales, Solutions, and Legal Information ...................... 42 Tools.......................................................................... 15 Worldwide Sales and Design Support....................... 42 Kits ............................................................................15 Products .................................................................... 42 Electrical Specifications ................................................ 16 PSoC Solutions ...................................................... 42 Absolute Maximum Ratings ...................................... 16 Cypress Developer Community................................. 42 BLE Subsystem......................................................... 16 Technical Support ..................................................... 42 Device-Level Specifications ...................................... 19 Analog Peripherals .................................................... 24 Document Number: 001-90478 Rev. *K Page 2 of 42

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
CYP
Cypress
Cypress / Spansion
CYPRESS SEMI
Cypress Semicon
Cypress Semiconductor
Cypress Semiconductor Corp
INF
INFINEON
Infineon IR
INFINEON (CYPRESS)
Infineon (IRF)
Infineon / Cypress
Infineon / IR
INFINEON TECH ICs
Infineon Technologies
INFINEON TECHNOLOGIES AG
Infineon Technologies Americas Corp.
Infinite Power Solutions
INTERNATIONAL RECTIF
INTERNATIONAL RECTIFIER
International Rectifier HiRel Products
INTL RECTIFIER
IR
IRH
Ramtron
Ramtron / Cypress Semiconductor
Ramtron International Corp
SP9
SPANSION

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