4N55, 5962-87679, HCPL-553x, HCPL-653x, HCPL-257K, HCPL-655x, 5962-90854, 1 HCPL-550x Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications Data Sheet Description Features These units are single-, dual-, and quad-channel, hermetically Dual marked with device part number and DLA Standard sealed optocouplers. The products are capable of operation Microcircuit Drawing (SMD) and storage over the full military temperature range and can Manufactured and tested on a MIL-PRF-38534 Certified be purchased as either Commercial product or with full Line MIL-PRF-38534 Class Level H or K testing or from the QML-38534, Class H and K appropriate DLA Standard Microcircuit Drawing (SMD). All Five hermetically sealed package configurations devices are manufactured and tested on a MIL-PRF-38534 Performance guaranteed over full military temperature certified line and Class H and K devices are included in the DLA range: 55C to +125C Qualified Manufacturers List QML-38534 for Hybrid High speed: 400 kb/s typical Microcircuits. 9-MHz bandwidth CAUTION It is advised that normal static precautions be Open collector output taken in handling and assembly of this V ranges from 2V to 18V CC component to prevent damage and/or 1500 VDC withstand test voltage degradation which may be induced by ESD. High radiation immunity 6N135, 6N136, HCPL-2530/2531 function compatibility Reliability data Applications Military and aerospace High reliability systems Vehicle command, control, life critical systems Line receiver Switching power supply Voltage level shifting Analog signal ground isolation (see Figures 7, 8, and 13) Isolated input line receiver Isolated output line driver Logic ground isolation Harsh industrial environments Isolation for test equipment systems 1. See the Selection Guide Package Styles and Lead Configuration Options table for available extensions. Broadcom - 1 -4N55, 5962-87679, HCPL-553x, HCPL-653x, HCPL-257K, HCPL-655x, 5962-90854, HCPL-550x Data Sheet Each channel contains a GaAsP light emitting diode that is Functional Diagram optically coupled to an integrated photon detector. Separate connections for the photodiodes and output transistor V CC collectors improve the speed up to one-hundred times that of a conventional phototransistor optocoupler by reducing the V B base-collector capacitance. V O These devices are suitable for wide-bandwidth analog applications, as well as for interfacing TTL to LSTTL or CMOS. Current Transfer Ratio (CTR) is 9% minimum at I = 16 mA. The F GND 18V V capability enables the designer to interface any TTL CC family to CMOS. The availability of the base lead allows optimized gain/bandwidth adjustment in analog applications. Multiple channel devices available. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor Truth Table couplers. Package styles for these parts are 8- and 16-pin DIP (Positive Logic) through-hole (case outlines P and E, respectively), 16-pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case Input Output outline 2). Devices may be purchased with a variety of lead On (H) L bend and plating options, see the selection guide table for Off (L) H details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. NOTE The connection of a 0.1 F bypass capacitor Because the same functional die (emitters and detectors) are between V and GND is recommended. CC used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for die related reliability and certain limited radiation test results. Broadcom - 2 -