X-On Electronics has gained recognition as a prominent supplier of W988D2FBJX6E dram across the USA, India, Europe, Australia, and various other global locations. W988D2FBJX6E dram are a product manufactured by Winbond. We provide cost-effective solutions for dram, ensuring timely deliveries around the world.

W988D2FBJX6E Winbond

W988D2FBJX6E electronic component of Winbond
Images are for reference only
See Product Specifications
Part No.W988D2FBJX6E
Manufacturer: Winbond
Category:DRAM
Description: DRAM Chip Mobile LPSDR SDRAM 256Mbit 8Mx32 1.8V 90-Pin VFBGA
Datasheet: W988D2FBJX6E Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 5.5464 ea
Line Total: USD 5.55

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 13 Jun to Wed. 19 Jun

MOQ : 240
Multiples : 1
240 : USD 5.223
250 : USD 5.1702
500 : USD 5.1187
1000 : USD 5.0673
2000 : USD 5.0172
2500 : USD 4.9671
3000 : USD 4.917
4000 : USD 4.8682
5000 : USD 4.8195
10000 : USD 4.7707

0 - WHS 2


Ships to you between Wed. 19 Jun to Fri. 21 Jun

MOQ : 1
Multiples : 1
1 : USD 5.5464
10 : USD 3.6994
25 : USD 3.6214
50 : USD 3.5991
100 : USD 3.276
240 : USD 3.2649
480 : USD 3.1757

   
Manufacturer
Product Category
Type
Mounting Style
Package / Case
Data Bus Width
Organisation
Memory Size
Maximum Clock Frequency
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.
Image Part-Description
Stock Image ISD17240PY
240 SEC PDIP
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image ISD1740SY
40 SEC 2.4-5.5V SINGLE CHIP MU
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image ISD4002-120S
120-sec 3V Single chip voice r
Stock : 343
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image ISD4003-04MS-T/R$FAB
4-MIN 3V SINGLE CHIP VOICE REC
Stock : 1000
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image ISD5116S
8-16-min 3V Single chip voice
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image ISD4003-04MS-T/R
4-MIN 3V SINGLE CHIP VOICE REC
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image ISD4004-08ME
8-min 3V Single chip voice rec
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W989D6DBGX6I
DRAM Chip Mobile LPSDR SDRAM 512Mbit 32Mx16 1.8V
Stock : 191
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W989D2DBJX6I
DRAM 512Mb LPSDR, x32, 166MHz, Ind Temp, 46nm
Stock : 194
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image W989D2DBJX6I
DRAM 512Mb LPSDR, x32, 166MHz, Ind Temp, 46nm
Stock : 194
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image RPM2
Relay Sockets & Fixings RP DINRAIL ADAPTOR
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image WP2001000-01G
MODULE, SERIAL TO WIFI, WIPORT
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image RPI-STANDOFF-KIT
HAT STANDOFF KIT FOR RASPBERRY PI
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image RPI COMPUTE MODULE
COMPUTE MODULE, RASPBERRY PI DEV BOARD
Stock : 1215
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image RPI COMPUTE DEV KIT
RASPBERRY PI COMPUTE MODULE DEV KIT
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image V5236B-T
Finger-shaped-heatsink - 18K/W - 30x25.4x7.9mm - black anodized - for TO-220, SOT-32
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image RPI-CABLE+ACC/DVI
CABLE & ACCESSORY BUNDLE (DVI)
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image RPI-BC A+-ADAPTER ATGY
ELECTRONIC HOUSING ADAPTER, RPI A+, GREY
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image RPI-BC 107,6 DEV-KIT KMGY P10
ELECTRONIC HOUSING, RASPBERRY PI, GREY
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
We are delighted to provide the W988D2FBJX6E from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W988D2FBJX6E and other electronic components in the DRAM category and beyond.

W988D6FB / W988D2FB 256Mb Mobile LPSDR Table of Contents- 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. ORDER INFORMATION ............................................................................................................. 4 4. BALL CONFIGURATION ............................................................................................................ 5 4.1 Ball Assignment: LPSDR x16 ......................................................................................... 5 4.2 Ball Assignment: LPSDR x32 ......................................................................................... 6 5. BALL DESCRIPTION .................................................................................................................. 7 5.1 Signal Description ........................................................................................................... 7 5.2 Addressing Table ............................................................................................................ 8 6. BLOCK DIAGRAM ...................................................................................................................... 9 7. FUNCTIONAL DESCRIPTION.................................................................................................. 10 7.1 Command Function ...................................................................................................... 10 7.1.1 Table 1. Truth Table (Note (1) and (2)) ................................................................... 10 7.1.2 Functional Truth Table (See Note 1) ...................................................................... 11 7.1.3 Functional Truth Table for CKE .............................................................................. 14 7.1.4 Bank Activate Command ........................................................................................ 15 7.1.5 Bank Precharge Command .................................................................................... 15 7.1.6 Precharge All Command ........................................................................................ 15 7.1.7 Write Command ...................................................................................................... 15 7.1.8 Write with Auto Precharge Command .................................................................... 15 7.1.9 Read Command ..................................................................................................... 15 7.1.10 Read with Auto Precharge Command .................................................................... 15 7.1.11 Extended Mode Register Set Command ................................................................ 16 7.1.12 Mode Register Set Command ................................................................................ 16 7.1.13 No-Operation Command ........................................................................................ 16 7.1.14 Burst Stop Command ............................................................................................. 16 7.1.15 Device Deselect Command .................................................................................... 16 7.1.16 Auto Refresh Command ......................................................................................... 16 7.1.17 Self Refresh Entry Command ................................................................................. 16 7.1.18 Self Refresh Exit Command ................................................................................... 17 7.1.19 Clock Suspend Mode Entry/Power Down Mode Entry Command .......................... 17 7.1.20 Clock Suspend Mode Exit/Power Down Mode Exit Command ............................... 17 7.1.21 Data Write/Output Enable, Data Mask/Output Disable Command .......................... 17 8. OPERATION ............................................................................................................................. 17 8.1 Read Operation ............................................................................................................. 17 8.2 Write Operation ............................................................................................................. 18 8.3 Precharge ..................................................................................................................... 18 8.3.1 Auto Precharge ....................................................................................................... 18 8.3.2 READ with auto precharge interrupted by a READ (with or without auto precharge) 19 Publication Release Date: Sep. 22, 2014 Revision: A01-006 - 1 - W988D6FB / W988D2FB 8.3.3 READ with auto precharge interrupted by a WRITE (with or without auto precharge) 19 8.3.4 WRITE with auto precharge interrupted by a READ (with or without auto precharge) 20 8.3.5 WRITE with auto precharge interrupted by a WRITE (with or without auto precharge) 20 8.4 Burst Termination.......................................................................................................... 21 8.5 Mode Register Operation .............................................................................................. 22 8.5.1 Burst Length field (A2~A0) ..................................................................................... 22 8.5.2 Addressing Mode Select (A3) ................................................................................. 22 8.5.3 Addressing Sequence for Sequential Mode ........................................................... 22 8.5.4 Addressing Sequence for Interleave Mode ............................................................. 23 8.5.5 Addressing Sequence Example (Burst Length = 8 and Input Address is 13) ......... 23 8.5.6 Read Cycle CAS Latency = 3 ................................................................................. 23 8.5.7 CAS Latency field (A6~A4) ..................................................................................... 24 8.5.8 Mode Register Definition ........................................................................................ 24 8.6 Extended Mode Register Description ........................................................................... 25 8.7 Simplified State Diagram .............................................................................................. 26 9. ELECTRICAL CHARACTERISTICS ......................................................................................... 27 9.1 Absolute Maximum Ratings .......................................................................................... 27 9.2 Operating Conditions .................................................................................................... 27 9.3 Capacitance .................................................................................................................. 27 9.4 DC Characteristics ........................................................................................................ 28 9.5 Automatic Temperature Compensated Self Refresh Current Feature ......................... 28 9.6 AC Characteristics and Operating Condition ................................................................ 29 9.6.1 AC Characteristics .................................................................................................. 29 9.6.2 AC Test Condition .................................................................................................. 30 9.6.3 AC Latency Characteristics .................................................................................... 31 10. CONTROL TIMING WAVEFORMS .......................................................................................... 32 10.1 Command Input Timing ................................................................................................ 32 10.2 Read Timing .................................................................................................................. 33 10.3 Control Timing of Input Data (x16)................................................................................ 34 10.4 Control Timing of Output Data (x16) ............................................................................. 35 10.5 Control Timing of Input Data (x32)................................................................................ 36 10.6 Control Timing of Output Data (x32) ............................................................................. 37 10.7 Mode Register Set (MRS) Cycle ................................................................................... 38 10.8 Extended Mode register Set (EMRS) Cycle ................................................................. 39 11. OPERATING TIMING EXAMPLE ............................................................................................. 40 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) ...................................... 40 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ........... 41 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) ...................................... 42 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ........... 43 11.5 Interleaved Bank Write (Burst Length = 8) ................................................................... 44 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ........................................ 45 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) .............................................. 46 Publication Release Date: Sep. 22, 2014 Revision: A01-006 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted