X-On Electronics has gained recognition as a prominent supplier of W947D6HBHX5I dram across the USA, India, Europe, Australia, and various other global locations. W947D6HBHX5I dram are a product manufactured by Winbond. We provide cost-effective solutions for dram, ensuring timely deliveries around the world.

W947D6HBHX5I

W947D6HBHX5I electronic component of Winbond
Images are for reference only
See Product Specifications
Part No.W947D6HBHX5I
Manufacturer: Winbond
Category:DRAM
Description: DRAM Chip Mobile LPDDR SDRAM 128Mbit 8Mx16 1.8V 60-Pin VFBGA
Datasheet: W947D6HBHX5I Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 312
Multiples : 1
312 : USD 4.2039
500 : USD 4.1619
1000 : USD 4.12
2000 : USD 4.0793
2500 : USD 4.0386
3000 : USD 3.9979
4000 : USD 3.9585
5000 : USD 3.9178
10000 : USD 3.8797
50000 : USD 3.8404
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1
1 : USD 7.5691
10 : USD 2.7813
25 : USD 2.7095
50 : USD 2.6992
100 : USD 2.4632
250 : USD 2.4529
500 : USD 2.3913
N/A

Obsolete
     
Manufacturer
Product Category
Type
Mounting Style
Package / Case
Data Bus Width
Organisation
Memory Size
Maximum Clock Frequency
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Part-Description
Stock Image W94AD6KBHX5E
DRAM Chip Mobile LPDDR SDRAM 1Gbit 64Mx16 1.8V 60-Pin VFBGA
Stock : 292
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W949D6DBHX5E
IC LPDDR SDRAM 512MBIT 60VFBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W949D2DBJX5I
DRAM 512Mb LPDDR, x32, 200MHz, Industrial Temp, 46nm
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W949D2DBJX5E
DRAM Chip Mobile LPDDR SDRAM 512Mbit 16Mx32 1.8V 90-Pin VFBGA
Stock : 105
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W948D2FBJX5I
DRAM Chip DDR SDRAM 256Mbit 8Mx32 1.8V 90-Pin VFBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W948D6FBHX5E
DRAM Chip Mobile LPDDR SDRAM 256Mbit 16Mx16 1.8V 60-Pin VFBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W948D6FBHX5I
DRAM Chip Mobile LPDDR SDRAM 256Mbit 16Mx16 1.8V 60-Pin VFBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W949D6DBHX5I
DRAM 512Mb LPDDR, x16, 200MHz, Industrial Temp, 46nm
Stock : 291
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W94AD2KBJX5I
DRAM Chip Mobile LPDDR SDRAM 1Gbit 32Mx32 1.8V 90-Pin VFBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W948D6KBHX5I
DRAM 256Mb LPDDR, x16, 200MHz, Industrial Temp
Stock : 23
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image IL-312-40PB-VF-A1
40 Position Connector Plug, Center Strip Contacts Surface Mount Gold
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9464G6KH-5
DRAM Chip DDR SDRAM 64Mbit 4Mx16 2.5V 66-Pin TSOP-II
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image IL-312-40PB-VF30-A1
40 Position Connector Plug, Center Strip Contacts Surface Mount Gold
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image CF12JT22R0
22 Ohms ±5% 0.5W, 1/2W Through Hole Resistor Axial Flame Retardant Coating, Safety Carbon Film
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image CE-60-U-BZ
CE-60-U-BZ
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image CF12JT220R
220 Ohms ±5% 0.5W, 1/2W Through Hole Resistor Axial Flame Retardant Coating, Safety Carbon Film
Stock : 3747
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image CF12JT20R0
20 Ohms ±5% 0.5W, 1/2W Through Hole Resistor Axial Flame Retardant Coating, Safety Carbon Film
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image PK15GTA
LOAD CENTER GROUND BAR
Stock : 38
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image CF12JT1R00
1 Ohms ±5% 0.5W, 1/2W Through Hole Resistor Axial Flame Retardant Coating, Safety Carbon Film
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
We proudly offer the W947D6HBHX5I DRAM at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the W947D6HBHX5I DRAM.

W947D6HB / W947D2HB 128Mb Mobile LPDDR TABLE OF CONTENTS 1. GENERAL DESCRIPTION .......................................................................................................... 4 2. FEATURES.................................................................................................................................. 4 3. PIN CONFIGURATION ................................................................................................................ 5 3.1 Ball Assignment: LPDDR X16 .......................................................................................................... 5 3.2 Ball Assignment: LPDDR X32 .......................................................................................................... 5 4. PIN DESCRIPTION ..................................................................................................................... 6 4.1 Signal Descriptions ........................................................................................................................... 6 4.2 Addressing Table ............................................................................................................................. 7 5. BLOCK DIAGRAM ...................................................................................................................... 8 5.1 Block Diagram .................................................................................................................................. 8 5.2 Simplified State Diagram .................................................................................................................. 9 6. FUNCTION DESCRIPTION ....................................................................................................... 10 6.1 Initialization .................................................................................................................................... 10 6.1.1 Initialization Flow Diagram ....................................................................................................................11 6.1.2 Initialization Waveform Sequence .........................................................................................................12 6.2 Register Definition .......................................................................................................................... 12 6.2.1 Mode Register Set Operation ................................................................................................................12 6.2.2 Mode Register Definition .......................................................................................................................13 6.2.3. Burst Length .........................................................................................................................................13 6.3 Burst Definition ............................................................................................................................... 14 6.4 Burst Type ...................................................................................................................................... 15 6.5 Read Latency ................................................................................................................................. 15 6.6 Extended Mode Register Description ............................................................................................. 15 6.6.1 Extended Mode Register Definition ......................................................................................................16 6.7 Status Register Read ..................................................................................................................... 16 6.7.1 SRR Register (A n:0 = 0) .....................................................................................................................17 6.7.2 Status Register Read Timing Diagram .................................................................................................18 6.8 Partial Array Self Refresh ............................................................................................................... 19 6.9 Automatic Temperature Compensated Self Refresh ....................................................................... 19 6.10 Output Drive Strength ................................................................................................................... 19 6.11 Commands ................................................................................................................................... 19 6.11.1 Basic Timing Parameters for Commands ...........................................................................................19 6.11.2 Truth Table - Commands ....................................................................................................................20 6.11.3 Truth Table - DM Operations ..............................................................................................................21 6.11.4 Truth Table - CKE ...............................................................................................................................21 6.11.5 Truth Table - Current State BANKn - Command to BANKn ...............................................................22 6.11.6 Truth Table - Current State BANKn, Command to BANKn .................................................................23 7. OPERATION.............................................................................................................................. 24 7.1. Deselect ........................................................................................................................................ 24 7.2. No Operation ................................................................................................................................. 24 7.2.1 NOP Command .....................................................................................................................................25 Publication Release Date:Jun,17, 2011 - 1 - Revision A01-003 W947D6HB / W947D2HB 128Mb Mobile LPDDR 7.3 Mode Register Set .......................................................................................................................... 25 7.3.1 Mode Register Set Command ...............................................................................................................25 7.3.2 Mode Register Set Command Timing ...................................................................................................26 7.4. Active ............................................................................................................................................ 26 7.4.1 Active Command ...................................................................................................................................26 7.4.2 Bank Activation Command Cycle ..........................................................................................................27 7.5. Read ............................................................................................................................................. 27 7.5.1 Read Command ....................................................................................................................................28 7.5.2 Basic Read Timing Parameters ............................................................................................................28 7.5.3 Read Burst Showing CAS Latency .......................................................................................................29 7.5.4 Read to Read ........................................................................................................................................29 7.5.5 Consecutive Read Bursts ......................................................................................................................30 7.5.6 Non-Consecutive Read Bursts ..............................................................................................................30 7.5.7 Random Read Bursts ............................................................................................................................31 7.5.8 Read Burst Terminate ...........................................................................................................................31 7.5.9 Read to Write ........................................................................................................................................32 7.5.10 Read to Pre-charge .............................................................................................................................32 7.5.11 Burst Terminate of Read .....................................................................................................................33 7.6 Write ............................................................................................................................................... 33 7.6.1 Write Command ....................................................................................................................................34 7.6.2 Basic Write Timing Parameters .............................................................................................................34 7.6.3 Write Burst (min. and max. tDQSS) ......................................................................................................35 7.6.4 Write to Write .........................................................................................................................................35 7.6.5 Concatenated Write Bursts ...................................................................................................................36 7.6.6 Non-Consecutive Write Bursts ..............................................................................................................36 7.6.7 Random Write Cycles ...........................................................................................................................37 7.6.8 Write to Read ........................................................................................................................................37 7.6.9 Non-Interrupting Write to Read .............................................................................................................37 7.6.10 Interrupting Write to Read ...................................................................................................................38 7.6.11 Write to Precharge ..............................................................................................................................38 7.6.12 Non-Interrupting Write to Precharge ...................................................................................................38 7.6.13 Interrupting Write to Precharge ...........................................................................................................39 7.7 Precharge ....................................................................................................................................... 39 7.7.1 Precharge Command ............................................................................................................................40 7.8 Auto Precharge .............................................................................................................................. 40 7.9 Refresh Requirements .................................................................................................................... 40 7.10 Auto Refresh ................................................................................................................................ 40 7.10.1 Auto Refresh Command ......................................................................................................................41 7.11 Self Referesh ................................................................................................................................ 41 7.11.1 Self Refresh Command .......................................................................................................................42 7.11.2 Auto Refresh Cycles Back-to-Back .....................................................................................................42 7.11.3 Self Refresh Entry and Exit .................................................................................................................43 7.12 Power Down ................................................................................................................................. 43 7.12.1 Power-Down Entry and Exit ................................................................................................................43 7.13 Deep Power Down........................................................................................................................ 44 Publication Release Date:Jun,17, 2011 - 2 - Revision A01-003

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted