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PH4130CL,115

PH4130CL,115 electronic component of NXP
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See Product Specifications
Part No. PH4130CL,115
Manufacturer: NXP
Category: MOSFET
Description: N-CHANNEL TRENCHMOS LOGIC LEVEL FET
Datasheet: PH4130CL,115 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

57: USD 0.5395 ea
Line Total: USD 30.75

0 - Global Stock
MOQ: 57  Multiples: 1
Pack Size: 1
     
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PH4025L N-channel TrenchMOS logic level FET Rev. 01 22 August 2007 Product data sheet 1. Product prole 1.1 General description Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. 1.2 Features n Logic level threshold n Lead-free package n Optimized for use in DC-to-DC n Very low switching and conduction converters losses n 100 % R tested n 100 % ruggedness tested G 1.3 Applications n DC-to-DC converters n Switched-mode power supplies n Voltage regulators n PC Motherboards 1.4 Quick reference data n V 25 V n I 99 A DS D n R 4.0 m n Q = 5 nC (typ) DSon GD 2. Pinning information Table 1. Pinning Pin Description Simplied outline Symbol 1, 2, 3 source (S) D mb 4 gate (G) mb mounting base; connected to drain (D) G mbb076 S 1234 SOT669 (LFPAK)PH4025L NXP Semiconductors N-channel TrenchMOS logic level FET 3. Ordering information Table 2. Ordering information Type number Package Name Description Version PH4025L LFPAK plastic single-ended surface-mounted package (lfpak); 4 leads SOT669 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V drain-source voltage 25 C T 150 C - 25 V DS j V drain-gate voltage (DC) 25 C T 150 C; R =20k -25 V DGR j GS V gate-source voltage - 20 V GS I drain current T =25 C; V = 10 V; see Figure 2 and 3 -99 A D mb GS T = 100 C; V = 10 V; see Figure 2 - 67.5 A mb GS I peak drain current T =25 C; pulsed; t 10 s; see Figure 3 - 300 A DM mb p P total power dissipation T =25 C; see Figure 1 - 46.4 W tot mb T storage temperature - 55 +150 C stg T junction temperature - 55 +150 C j Source-drain diode I source current T =25 C - 52 A S mb I peak source current T =25 C; pulsed; t 10 s - 208 A SM mb p Avalanche ruggedness E non-repetitive drain-source unclamped inductive load; I =56A; - 150 mJ DS(AL)S D avalanche energy t = 0.16 ms; V 25 V; R =50 ; p DS GS V = 10 V; starting at T =25 C GS j PH4025L_1 NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 22 August 2007 2 of 12

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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NXP / Freescale
NXP SEMI
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