Document Number MC9S08PL4 NXP Semiconductors Rev. 3, 08/2019 Data Sheet: Technical Data MC9S08PL4 MC9S08PL4 Series Data Sheet Supports: MC9S08PL4 Key features Development support Single-wire background debug interface 8-Bit S08 central processor unit (CPU) Breakpoint capability to allow three breakpoints Up to 20 MHz bus at 2.7 V to 5.5 V across setting during in-circuit debugging temperature range of -40 C to 85 C On-chip in-circuit emulator (ICE) debug module Supporting up to 40 interrupt/reset sources containing two comparators and nine trigger modes Supporting up to four-level nested interrupt On-chip memory Peripherals Up to 4 KB flash read/program/erase over full ACMP - one analog comparator with both positive operating voltage and temperature and negative inputs separately selectable interrupt Up to 128 byte EEPROM 2-byte erase sector on rising and falling comparator output filtering program and erase while executing flash ADC - 8-channel, 10-bit resolution 2.5 s Up to 512 byte random-access memory (RAM) conversion time data buffers with optional Flash and RAM access protection watermark automatic compare function internal bandgap reference channel operation in stop mode Power-saving modes optional hardware trigger One low-power stop mode reduced power wait FTM - two 2-channel flex timer modulators mode modules 16-bit counter each channel can be Peripheral clock enable register can disable clocks to configured for input capture, output compare, edge- unused modules, reducing currents allows clocks to or center-aligned PWM mode remain enabled to specific peripherals in stop3 mode RTC - 16-bit real timer counter (RTC) Clocks SCI - one serial communication interface (SCI/ Oscillator (XOSC) - loop-controlled Pierce UART) modules optional 13-bit break full duplex oscillator crystal or ceramic resonator range of non-return to zero (NRZ) LIN extension support 31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz Input/Output Internal clock source (ICS) - containing a frequency- Up to 18 GPIOs including one output-only pin locked-loop (FLL) controlled by internal or external One 8-bit keyboard interrupt module (KBI) reference precision trimming of internal reference allowing 1% deviation across temperature range of 0 Package options C to 70 C and 2% deviation across whole 20-pin TSSOP operating temperature range up to 20 MHz 16-pin TSSOP 8-pin SOIC System protection Watchdog with independent clock source Low-voltage detection with reset or interrupt selectable trip points Illegal opcode detection with reset Illegal address detection with reset NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 MCU block diagram...........................................................................3 6.2.1 Control timing..............................................................13 2 Orderable part numbers......................................................................4 6.2.2 Debug trace timing specifications................................14 3 Part identification...............................................................................4 6.2.3 FTM module timing.....................................................15 3.1 Description.................................................................................4 6.3 Thermal specifications...............................................................16 3.2 Format........................................................................................4 6.3.1 Thermal operating requirements.................................. 16 3.3 Fields..........................................................................................5 6.3.2 Thermal characteristics................................................ 16 3.4 Example..................................................................................... 5 7 Peripheral operating requirements and behaviors..............................17 4 Parameter Classification.....................................................................5 7.1 External oscillator (XOSC) and ICS characteristics..................17 5 Ratings................................................................................................6 7.2 NVM specifications...................................................................19 5.1 Thermal handling ratings...........................................................6 7.3 Analog........................................................................................20 5.2 Moisture handling ratings..........................................................6 7.3.1 ADC characteristics..................................................... 20 5.3 ESD handling ratings.................................................................6 7.3.2 Analog comparator (ACMP) electricals...................... 23 5.4 Voltage and current operating ratings........................................6 8 Dimensions.........................................................................................23 6 General............................................................................................... 7 8.1 Obtaining package dimensions..................................................23 6.1 Nonswitching electrical specifications...................................... 7 9 Pinout................................................................................................. 24 6.1.1 DC characteristics........................................................ 7 9.1 Signal multiplexing and pin assignments.................................. 24 6.1.2 Supply current characteristics...................................... 12 9.2 Device pin assignment...............................................................25 6.1.3 EMC performance........................................................13 10 Revision history................................................................................. 26 6.2 Switching specifications............................................................ 13 MC9S08PL4 Series Data Sheet, Rev. 3, 08/2019 2 NXP Semiconductors