A10198-11 Laird Connectivity

Tflex 200T V0 Series Thermal Gap Filler THIN THERMALLY CONDUCTIVE ELASTOMERIC INTERFACE MATERIAL Tflex 200T V0 is a specially formulated thin gap filler thermal interface material designed for thin interfaces that require a combination good thermal performance with great reliability. The elastomeric property of Tflex 200T V0 provides good thermal performance in a thin interface where reliability and shock and vibration considerations are critical performance considerations in addition to low thermal resistance. Tflex 200T V0s unique silicone and ceramic filler technology allows a combination of great reliability, good thermal performance, and easy handling. APPLICATIONS FEATURES Thermal Conductivity 1.5 W/mK Memory Modules: DDR2, DDR3, SDRAM, SRAM, RAM, NVRAM Compliant Elastomeric based thin interface material LED solid state lighting Available in 0.008-inch (0.2mm), 0.010-inch Power electronics (0.25mm), 0.012-inch (0.30mm), 0.015- inch (0.38mm) , and 0.020-inch (0.51mm) thicknesses Slightly tacky for adhesion during assembly and transport Competitive price for high volume applications Available as individual custom parts, sheets, or custom parts converted on a roll Americas: +1.800.843.4556 Europe: +49.8031.24600 Asia: +86.755.2714.116 CLV-customerservice lairdtech.com Tflex 200T V0 Series Thermal Gap Filler 8 MIL 10 MIL 15 MIL TEST METHOD Ceramic filled Ceramic filled Ceramic filled Construction & silicone elastomer, silicone elastomer, silicone elastomer, Composition reinforced reinforced reinforced Color Light Grey Light Grey Light Grey Visual 0.008 0.010 0.015 Thickness (0.203mm) (0.254mm) (0.381mm) 0.0015 0.0015 0.00225 Thickness tolerance (0.038mm) (0.038mm) (0.057mm) Specific Gravity Helium 2.32 g/cc 2.32 g/cc 2.32 g/cc (Density) Pycnometer Hardness 3 seconds 55 55 55 ASTM D2240 (Shore 00) Outgassing TML 0.38% 0.38% 0.38% ASTM E595 (Post Cured) Outgassing CVCM 0.11% 0.11% 0.11% ASTM E595 (Post Cured ) UL Flammability 94 V0 94 V0 94 V0 E180840 Rating Temperature Range -45C to 200C -45C to 200C -45C to 200C Thermal Conductivity 1.5 W/mK 1.5 W/mK 1.5 W/mK Hot Disk Thermal Impedance 0.384C-in/W 0.488C-in/W 0.714C-in/W ASTM D5470 10 psi 2.48C-cm/W 3.14C-cm/W 4.60C-cm/W (modified) 69 KPa Thermal Expansion IPC-TM-650 231.19ppm/C 231.19ppm/C 231.19ppm/C (30-150C) 2.4 2.4 10 10 10 Volume Resistivity 3.5x10 ohm-cm 3.5x10 ohm-cm 3.5x10 ohm-cm ASTM D257 Dielectric Constant 5.0 5.1 5.1 ASTM D150 1 MHz Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. THR-DS-TFLEX-200T-V0 0714 Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies terms and conditions of sale in eect frff om time to time, a copy of which will be furnished upon request.damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies terms and conditions of sale in eect frff om time to time, a copy of which will be furnished upon request. A15922-00 Rev D., 07/14. 2014 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc.