AA3528P3S Kingbright

3.5x2.8mm PHOTOTRANSISTOR Part Number: AA3528P3S Description Features Made with NPN silicon phototransistor chips. z Mechanically and spectrally matched to the infrared emitting LED lamp. z Package : 2000pcs / reel. z Moisture sensitivity level : level 3. z RoHS compliant. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01 ) unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAL0864 REV NO: V.6 DATE: OCT/07/2016 PAGE: 1 OF 6 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1201006871 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H S might corrode silver plating of 2 leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAL0864 REV NO: V.6 DATE: OCT/07/2016 PAGE: 2 OF 6 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1201006871