.. MESHTEK-H52 Bluetooth 5.0 Ready Module FEATURES Simple & fast integration with development kits and sample iOS & Android API Built-in reliable Connection based mesh to support large data packets, Mesh Network (Node and Bridge) for Android Long-range, module connectivity up to 120 meters Compact form factor 17.4mm X 20.4mm X MESHTEK-H52 Bluetooth 4.2 Low 3mm Energy Module Castellated SMT pads for easy and reliable PCB mounting DESCRIPTION Over the Air firmware update from one With the smartest and most robust Bluetooth device to an entire network Mesh Network technology on the market, ilumis 32-bit ARM Cortex M4F nRF52832 CPU MeshTek provides an elegant and affordable Proximity support for beacon and location solution for manufacturers looking to quickly and based services reliably bring BLE enabled IoT products to market. No. of GPIOs available for user - 26 Configurable I/O mapping for analog and The MESHTEK-H52 Smart Mesh Module with digital integrated PCB antenna reduces development Simultaneous master and slave operation time, lowers manufacturing costs and eases Certifications: FCC, IC, CE, BT SIG (testing certification. No RF expertise required to integrate completed) this module. This complete platform solution RoHS compliant includes software drivers, sample applications, API guide, user documentation and a world-class OPERATIONAL support. Operating voltage range: 1.7V to 3.6VDC Temperature range: -40C to 85C The MESHTEK-H52 internal controller can be used Low-power consumption for applications up to 64KB flash without the need Interface: SPI, UART, NFC, I2C and 8/9/10bit for external host MCU or software development ADC tools. 512KB flash and 64KB RAM APPLICATIONS Lighting bulbs and fixtures Automotive Home Automation Power plugs, routers Internet of Things (IoT) AV consoles Industrial Control ilumi Solutions Inc www.ilumisolutions.com P a g e 1 15 MESHTEK-H52 TABLE OF CONTENTS 1. DEVICE OVERVIEW ........................................................................................................................ 4 2. GENERAL SPECIFICATIONS ............................................................................................................ 6 3. PHYSICAL DIMENSIONS ................................................................................................................. 7 4. REGULATORY APPROVAL .............................................................................................................. 9 4.1. EUROPEAN UNION REGULATORY COMPLIANCE........................................................................... 9 4.2. FCC AND IC COMPLIANCE ............................................................................................................. 9 4.2.1. FCC STATEMENT ............................................................................................................................ 9 4.2.2. IC COMPLIANCE ........................................................................................................................... 10 4.2.3. CONFORMIT AUX NORMS DIC ................................................................................................. 10 4.2.4. OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ......... 10 4.2.5. OEM LABELING REQUIREMENTS FOR END PRODUCT ................................................................ 11 5. PRODUCT HANDLING .................................................................................................................. 12 5.1. SOLDER REFLOW PROFILE ........................................................................................................... 12 6. PACKAGING AND LABELLING ...................................................................................................... 13 7. ORDERING INFORMATION .......................................................................................................... 14 8. REVISION HISTORY ...................................................................................................................... 15 Table 1: PINOUT DRESCPTION ...................................................................................................................... 5 Table 2: ELECTRICAL SPECIFICATIONS ........................................................................................................... 6 Table 3: MESHTEK-H52 ETSI Conformity....................................................................................................... 9 Table 4: MESHTEK-H52 FCC and IC Conformity ............................................................................................ 9 Table 5: ORDERING INFORMATION .......................................................................................................... 144 Figure 1: MESHTEK-H52 BLOCK DIAGRAM ................................................................................................... 4 Figure 2: MESHTEK-H52 PINOUT .................................................................................................................. 4 Figure 3: MESHTEK-H52 MODULE TOP AND BOTTOM VIEW ....................................................................... 7 Figure 4: MESHTEK-H52 RECOMMENDED PCB FOOTPRINT ......................................................................... 7 Figure 5: MESHTEK-H52 MODULE MOUNTING DETAILS .............................................................................. 8 Figure 6: REFLOW PROFILE ......................................................................................................................... 12 Figure 7: CARRIER TAPE DIMENSIONS ........................................................................................................ 12 Figure 8: PAKCAGING LABEL ....................................................................................................................... 12 ilumi solutions, inc. www.ilumisolutions.com P a g e 2 15