ILCX18 Series Product Features: Applications: SMD Package PCMCIA Cards Small package Footprint Storage Supplied in Tape and Reel PCs Compatible with Leadfree Processing GSM Cell Phone Fundamental Mode up to 60MHz Wireless Lan USB GSM Cell Phone Electrical Specifications: Frequency 12MHz to 60MHz Equivalent Series Resistance 12MHz 19.999999MHz 100 Ohms Maximum 20MHz 29.999999MHz 80 Ohms Maximum 30MHz 39.999999MHz 60 Ohms Maximum 40MHz 60MHz 40 Ohms Maximum Shunt Capacitance (C0) 3.5pF Maximum Frequency Tolerance (at 25C) 50ppm, 30ppm, 25ppm, 20ppm, 15ppm, or 10ppm Frequency Stability (over Temperature) 50ppm, 30ppm, 25ppm, 20ppm, 15ppm, or 10ppm Mode of Operation Fundamental Crystal Cut AT Cut Load Capacitance 8pF to 32pF or Specify Drive Level 100W Maximum Aging 3ppm/Year Maximum Operating Temperature Range See Part Number Guide Storage Temperature Range -40C to +125C Mechanical and Solder Pad Dimensions: Pin Connections Pin 1 Crystal Pin 2 Cover/Ground Pin 3 Crystal Pin 4 Cover/Ground Dimension Units: mm Part Number Guide Sample Part Number: ILCX18 - FB1F18 - 20.000 MHz Package Frequency Frequency Operating Mode of Operations Load Frequency Tolerance Stability Temperature Range Capacitance B = 50 ppm B = 50 ppm 0 = 0C to +50C F = 30 ppm F = 30 ppm 1 = 0C to +70C G = 25 ppm G = 25 ppm 2 = -10C to +60C H = 20 ppm H = 20 ppm 3 = -20C to +70C 8pF to 32pF -20.000MHz ILCX18 - F = Fundamental I = 15 ppm I = 15 ppm** 5 = -40C to +85C or Specify J = 10 ppm* J = 10 ppm** 8 = -30C to +85C 9 = -10C to +50C D = -10C to +105C* E = -40C to +105C* * Not available at all frequencies. ** Not available for all temperature ranges. Revised H: 09/26/18 Page 2 of 6 www.ilsiamerica.com ILCX18 Series Pb Free Solder Reflow Profile: Ts max to T (Ramp-up Rate) 3C / second max L Preheat Temperature min (Ts min) 150C Temperature typ (Ts typ) 175C Temperature max (Ts max) 200C Time (Ts) 60 to180 seconds Ramp-up Rate (T to Tp) 3C / second max L Time Maintained Above Temperature (T ) 217C L Time (TL) 60 to 150 seconds 260C max for 10 Peak Temperature (Tp) seconds Time within 5C to Peak 20 to 40 seconds Temperature (Tp) Ramp-down Rate 6C / second max Tune 25C to Peak Temperature 8 minutes max Units are backward compatible with +240C reflow processes Package Information: MSL = 1 Termination = e4 (Au over Ni over W base metallization). Tape and Reel Information: PITCH 4.00 TAPE WIDTH 8.00 REEL DIA 180 QTY PER REEL 3,000 Revised H: 09/26/18 Page 3 of 6 www.ilsiamerica.com