Product Information

CG0603MLC-3.3LEA

CG0603MLC-3.3LEA electronic component of Bourns

Datasheet
ESD Suppressors / TVS Diodes CHIP GUARD 3.3VOLT LOW LEAKAGE

Manufacturer: Bourns
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.5589 ea
Line Total: USD 0.5589

32007 - Global Stock
Ships to you between
Wed. 10 Apr to Fri. 12 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
13613 - Global Stock


Ships to you between Wed. 10 Apr to Fri. 12 Apr

MOQ : 1
Multiples : 1
1 : USD 0.4761
10 : USD 0.3542
100 : USD 0.2335
500 : USD 0.2024
1000 : USD 0.146
5000 : USD 0.1426
10000 : USD 0.1357
25000 : USD 0.1265
50000 : USD 0.1242

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Series
Product Type
Vesd - Voltage ESD Contact
Vesd - Voltage ESD Air Gap
Polarity
Number of Channels
Termination Style
Breakdown Voltage
Working Voltage
Clamping Voltage
Cd - Diode Capacitance
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Operating Voltage
Capacitance
Current Rating
Operating Temperature Range
Brand
Channels
Factory Pack Quantity :
Tradename
Cnhts
Hts Code
Subcategory
Taric
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Features Applications RoHS compliant* HDMI1.4 ESD protection >25 kV DigitalVisualInterface(DVI) Low capacitance <0.5 pF USB3.0/USBOTG Low leakage current <50 nA Memory protection SIM card ports ChipGuard MLC Series - ESD Protectors Device Symbol General Information The ChipGuard MLC Series has been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLC family has been designed to protect equipment to IEC61000-4-2, Level 4 (8 kV Contact / 15 kV Air Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394 applications. V The ChipGuard MLC Series has been manufactured to provide low 0.5 pF capacitance and leakage currents less than 5 nA with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics 25 C (unless otherwise noted) CG0402MLC- Parameter Symbol Unit 3.3LG 05LG 12LG 24LG 3.3LGA 05LGA 12LGA 24LGA Typical Continuous Operating Voltage V 3.3 5 12 24 3.3 5 12 24 V DC Typical Clamping Voltage (Note 1) V 25 V C Maximum Capacitance 1 VRMS 1 MHz C 0.5 pF O Maximum Leakage Current Max. VDC I 5nA L Typical Trigger Voltage (Note 2) V 250 V T Maximum Response Time R 1ns T ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge kV 8 Min. Air Discharge kV 15 (Note 3) Min. Air Discharge kV 25 Operating Temperature T -40 to +85 -40 to +125 C OPR Storage Temperature T -55 to +150 C STG CG0603MLC- Parameter Symbol Unit 3.3LE 05LE 12LE 24LE 3.3LEA 05LEA 12LEA 24LEA Typical Continuous Operating Voltage V 3.3 5 12 24 3.3 5 12 24 V DC Typical Clamping Voltage (Note 1) V 25 25 25 V C Maximum Capacitance 1 VRMS 1 MHz C 0.5 pF O Maximum Leakage Current Max. VDC I 55 5 nA L Typical Trigger Voltage (Note 2) V 250 250 250 V T Maximum Response Time R 1ns T ESD Protection: Per IEC 61000-4-2 Level 4 Min. Contact Discharge kV 8 Min. Air Discharge kV 15 (Note 3) Min. Air Discharge kV 25 Operating Temperature T -40 to +85 -40 to +125 C OPR Storage Temperature T -55 to +150 C STG Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse. 2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage. 3. IEC 61000-4-2 ESD Performance will meet minimum 1000 reps without degradation in performance. WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specications are subject to change without notice. Users should verify actual device performance in their specic applications. The products described herein and this document are subject to specic legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. *RoHS COMPLIANT ChipGuard MLC Series -ESD Protectors Product Dimensions Recommended Pad Layout A A W B L MM C B DIMENSIONS: (INCHES) D CG0402 CG0603 CG0402 CG0603 Dimension Series Series Dim. Series Series 1.00 0.15 1.60 0.20 0.51 0.76 L A (0.04 0.006) (0.064 0.008) (0.020) (0.030) 0.50 0.10 0.80 0.20 0.61 1.02 W B (0.02 0.004) (0.032 0.008) (0.024) (0.040) 0.36 0.05 0.45 0.10 0.51 0.50 A C (0.014 0.002) (0.018 0.004) (0.020) (0.020) 0.25 0.15 0.30 0.20 1.70 2.54 B D (0.10 0.006) (0.012 0.008) (0.067) (0.100) Preheat Stages 1-3 Soldering Cooling 300 A Stage 1 Preheat Ambient to Preheating 30 s to 60 s 250 Temperature B Stage 2 Preheat 140 C to 160 C 60 s to 120 s 200 C Stage 3 Preheat Preheat to 200 C 20 s to 40 s 150 D Main Heating 200 C 60 s to 70 s 210 C 55 s to 65 s 100 220 C 50 s to 60 s 230 C 40 s to 50 s 50 240 C 30 s to 40 s 250 C to 255 C 5 s 0 E Cooling 200 C to 100 C 1 C/s to 4 C/s 110 sec. (min.) 120 sec. (min.) 30-70 sec. Time (seconds) This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specications are subject to change without notice. Users should verify actual device performance in their specic applications. The products described herein and this document are subject to specic legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Temperature (C)

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
BOURNS
Bourns Inc.
BOURNS JW MILLER
BR4
J.W. Miller
JW Miller

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